Invention Grant
- Patent Title: Semiconductor device including semiconductor dies of differing sizes and capacities
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Application No.: US17175069Application Date: 2021-02-12
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Publication No.: US11552050B2Publication Date: 2023-01-10
- Inventor: Ahmad Zarif Bin Azahar , Nur Syazwani Binti Mohd Najman , Muhammad Syafiq Bin Mazlan , Rolando Reyes, Jr. , Hooi Bin Lim
- Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
- Applicant Address: US CA San Jose
- Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Jose
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00
Abstract:
A semiconductor device includes a stack of semiconductor dies, stacked in a stepped offset configuration, where the dies have different storage capacities and different sizes. Using dies of different sizes allows dies to be added to the stack without adding to the footprint of the semiconductor device. Using dies of different storage capacity also allows semiconductor devices to be tailored to specific storage capacity needs.
Public/Granted literature
- US20220230992A1 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZES AND CAPACITIES Public/Granted day:2022-07-21
Information query
IPC分类:
