Invention Grant
- Patent Title: Memory device, memory array and method of forming the same
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Application No.: US16994746Application Date: 2020-08-17
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Publication No.: US11552128B2Publication Date: 2023-01-10
- Inventor: Wei Chang , Eng Huat Toh , Juan Boon Tan , Shyue Seng Tan
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner MBB
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
A memory device may be provided. The memory device may include a substrate, wherein the substrate includes a well having a first conductivity type. The memory device may further include a contact element arranged in the well and including a first contact having the first conductivity type; a diode layer arranged in the well and having a second conductivity type opposite to the first conductivity type; and a dummy gate configured to isolate the first contact from the diode layer. The memory device may further include a memory element electrically connected to the diode layer.
Information query
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