Disclosed is an optical package assembly. The optical package assembly includes a substrate (100), a light sensor chip (200), and a protection portion. The protection portion and the light sensor chip (200) both are fixed to the substrate (100), the light sensor chip (200) is packaged in the protection portion, a plane on which the light sensor chip (200) is located intersects with a plane of the substrate (100), and the protection portion includes a light entering region. Further disclosed is a mobile terminal.