Invention Grant
- Patent Title: Pixel array substrate
-
Application No.: US17008607Application Date: 2020-08-31
-
Publication No.: US11552230B2Publication Date: 2023-01-10
- Inventor: Shang-Jie Wu , Hao-An Chuang , Yu-Chieh Kuo , He-Yi Cheng , Che-Chia Chang , Yi-Jung Chen , Yi-Fan Chen , Yu-Hsun Chiu , Mei-Yi Li , Yu-Chin Wu
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW109116012 20200514
- Main IPC: H01L33/62
- IPC: H01L33/62 ; G09G3/00 ; G09G3/32

Abstract:
A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.
Public/Granted literature
- US20210359180A1 PIXEL ARRAY SUBSTRATE Public/Granted day:2021-11-18
Information query
IPC分类: