Invention Grant
- Patent Title: Solid-state imaging element and solid-state imaging device
-
Application No.: US16979992Application Date: 2019-03-04
-
Publication No.: US11552268B2Publication Date: 2023-01-10
- Inventor: Shintarou Hirata , Hideaki Togashi , Yukio Kaneda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2018-050808 20180319
- International Application: PCT/JP2019/008348 WO 20190304
- International Announcement: WO2019/181456 WO 20190926
- Main IPC: H01L51/42
- IPC: H01L51/42 ; H01L27/30

Abstract:
A solid-state imaging element including: a photoelectric conversion layer, a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween, a semiconductor layer provided between the first electrode and the photoelectric conversion layer, an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween, an insulating film provided between the accumulation electrode and the semiconductor layer, and a barrier layer provided between the semiconductor layer and the photoelectric conversion layer.
Public/Granted literature
- US20210020857A1 SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE Public/Granted day:2021-01-21
Information query
IPC分类: