A method for quantitatively analyzing cohesive failure of an electrode analyzes cohesive failure of an electrode and includes preparing an electrode in which an electrode material mixture layer including an electrode active material, a conductive agent, and a binder is formed on a current collector, measuring shear strength (σ) data according to a cutting depth while cutting the electrode material mixture layer from a surface thereof until reaching the current collector using a surface and interfacial cutting analysis system (SAICAS), obtaining a regression curve of shear strength according to the cutting depth from the shear strength (σ) data, and determining a cutting depth, at which the shear strength is minimum in the regression curve, as a location of cohesive failure.