Invention Grant
- Patent Title: Battery pack with overmolded module
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Application No.: US16880076Application Date: 2020-05-21
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Publication No.: US11552339B2Publication Date: 2023-01-10
- Inventor: Haran Balaram , Nathan J. Bohney , Jonathan C. Wilson
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton
- Main IPC: H01M10/42
- IPC: H01M10/42 ; H01M50/50

Abstract:
Battery systems according to embodiments of the present technology may include a battery including a first electrode terminal and a second electrode terminal accessible along a first surface of the battery. The battery systems may also include a module electrically coupled with the battery. The module may include a first mold extending toward the battery. The first mold may define a recess along a first surface of the first mold proximate the first electrode terminal and the second electrode terminal. The module may include a first conductive tab electrically coupling the module with the first electrode terminal. The first electrode terminal may be at least partially positioned within a space defined by the recess defined by the first mold. The module may also include a second conductive tab electrically coupling the module with the second electrode terminal.
Public/Granted literature
- US20200381783A1 BATTERY PACK WITH OVERMOLDED MODULE Public/Granted day:2020-12-03
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