Invention Grant
- Patent Title: Split-ring resonator, board and connector
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Application No.: US17046519Application Date: 2019-04-03
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Publication No.: US11552399B2Publication Date: 2023-01-10
- Inventor: Keishi Kosaka , Eiji Hankui , Hiroshi Toyao , Yasuhiko Matsunaga
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2018-077203 20180412
- International Application: PCT/JP2019/014785 WO 20190403
- International Announcement: WO2019/198588 WO 20191017
- Main IPC: H01P7/08
- IPC: H01P7/08 ; H01Q9/04 ; H01Q1/48
Abstract:
A split-ring resonator comprises a first ground terminal which is separated from a ground pattern.
Public/Granted literature
- US20210167505A1 SPLIT-RING RESONATOR, BOARD AND CONNECTOR Public/Granted day:2021-06-03
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