Invention Grant
- Patent Title: Rugged memory module retainer clip system
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Application No.: US16790663Application Date: 2020-02-13
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Publication No.: US11552416B2Publication Date: 2023-01-10
- Inventor: Kwang Jin Gooi , Muhammad Annuar Bin Johani , Ali Akbar Bin Abdul Aziz
- Applicant: SMART Modular Technologies Sdn. Bhd.
- Applicant Address: MY Pulau Pinang
- Assignee: SMART Modular Technologies Sdn. Bhd.
- Current Assignee: SMART Modular Technologies Sdn. Bhd.
- Current Assignee Address: MY Pulau Pinang
- Agency: Withrow & Terranova, P.L.L.C.
- Priority: MYPI2019007836 20191227
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R43/26 ; F16B2/22

Abstract:
A memory module testing system operating in a vibratory environment can retain a memory module in place in a memory socket using both socket latches and a retainer clip. The retainer clip can attach to a module support tower of the memory socket. The retainer clip can have a flexible multi-spring structure forming a three-axis vibration dampening system that can prevent the socket latches from opening while testing in the test environment. The retainer clip can secure the socket latches using an upper flange and a lower flange to prevent unintended motion of the socket latches. The retainer clip can be secured to the module support towers at the ends of the memory socket using clip arms and clip arm tips to attach to the module support towers.
Public/Granted literature
- US20210203090A1 RUGGED MEMORY MODULE RETAINER CLIP SYSTEM Public/Granted day:2021-07-01
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