Invention Grant
- Patent Title: Relay apparatus and relay method
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Application No.: US17452794Application Date: 2021-10-29
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Publication No.: US11553040B2Publication Date: 2023-01-10
- Inventor: Kiyotaka Takahashi , Yuji Ogata
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JPJP2020-183737 20201102
- Main IPC: H04L67/12
- IPC: H04L67/12 ; G06F3/02

Abstract:
To provide a relay apparatus and a relay method by which an app can be flexibly connected to a device and various apps can be connected to various devices to realize stable operation. The invention is a relay method for mediating a connection between an app and a device, and the relay method includes: when an input specification of data required for an app whose use is to be started is input, comparing an output specification held by each processing node provided in an existing data processing path with a data item included in the input specification; connecting an output of the data processing path to the app whose use is to be started if the existing processing node and the existing data processing path are able to satisfy the input specification; adding a new processing node and comparing an output specification of the new processing node with the input specification if the existing data processing path is not able to satisfy the input specification; and connecting an output of the new processing node to the app whose use is to be started if the new processing node is able to satisfy the input specification.
Public/Granted literature
- US20220141286A1 Relay Apparatus and Relay Method Public/Granted day:2022-05-05
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