Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.