Invention Grant
- Patent Title: Component carrier comprising pillars on a coreless substrate
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Application No.: US16713527Application Date: 2019-12-13
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Publication No.: US11553599B2Publication Date: 2023-01-10
- Inventor: Yu-Hui Wu
- Applicant: AT&S (Chongqing) Company Limited
- Applicant Address: CN Chongqing
- Assignee: AT&S (Chongqing) Company Limited
- Current Assignee: AT&S (Chongqing) Company Limited
- Current Assignee Address: CN Chongqing
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN20181158190537 20181224
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K3/06 ; H05K3/10 ; H05K3/24 ; H05K3/36 ; H05K3/40 ; H01L21/02 ; H01L21/28 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/56 ; H01L21/58 ; H01L21/60 ; H01L21/78 ; H01L21/98 ; H01L21/768 ; H01L23/00 ; H01L23/06 ; H01L23/10 ; H01L23/31 ; H01L23/34 ; H01L23/36 ; H01L23/50 ; H01L23/52 ; H01L23/488 ; H01L23/498 ; H01L23/528 ; H01L23/532 ; H01L23/538 ; H05K3/46 ; H05K1/14
Abstract:
A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.
Public/Granted literature
- US1712133A Condensing zinc vapor Public/Granted day:1929-05-07
Information query
