Invention Grant
- Patent Title: Heat dissipation base
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Application No.: US17125583Application Date: 2020-12-17
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Publication No.: US11553621B2Publication Date: 2023-01-10
- Inventor: Cheng-Ju Chang , Ming-Yuan Lo , Ching-An Liu
- Applicant: Auras Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Auras Technology Co., Ltd.
- Current Assignee: Auras Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109143264 20201208
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H01L23/427

Abstract:
A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.
Public/Granted literature
- US20210345517A1 HEAT DISSIPATION BASE Public/Granted day:2021-11-04
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