Invention Grant
- Patent Title: Mounting device, information processing device, mounting method, and information processing method
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Application No.: US16769408Application Date: 2017-12-13
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Publication No.: US11553633B2Publication Date: 2023-01-10
- Inventor: Shigeto Oyama , Jun Iisaka
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/044783 WO 20171213
- International Announcement: WO2019/116472 WO 20190620
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08

Abstract:
A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.
Public/Granted literature
- US20210195818A1 MOUNTING DEVICE, INFORMATION PROCESSING DEVICE, MOUNTING METHOD, AND INFORMATION PROCESSING METHOD Public/Granted day:2021-06-24
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