Invention Grant
- Patent Title: Method for measuring distance of diffusion of curing catalyst
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Application No.: US16808637Application Date: 2020-03-04
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Publication No.: US11555697B2Publication Date: 2023-01-17
- Inventor: Tsutomu Ogihara , Tsukasa Watanabe , Yoshio Kawai , Tomohiro Kobayashi , Yusuke Biyajima , Masahiro Kanayama
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-086505 20190426
- Main IPC: G01B15/02
- IPC: G01B15/02 ; C08G77/08 ; G03F7/004 ; G03F7/075 ; G03F7/11 ; G03F7/20 ; G03F7/32

Abstract:
A method for measuring a distance of diffusion of a curing catalyst for a thermosetting silicon-containing material includes the steps of: forming a silicon-containing film from a composition containing a thermosetting silicon-containing material, a curing catalyst and a solvent; coating the silicon-containing film with a photosensitive resin composition containing a resin whose solubility in alkaline developer is increased by the action of an acid, an acid generator and a solvent, and subsequently heating to prepare a substrate on which the silicon-containing film and a resin film are formed; irradiating the substrate with a high energy beam or an electron beam to generate an acid and heat-treating the substrate to increase the solubility of the resin in an alkaline developer by the action of the acid in the resin film; dissolving the resin film in an alkaline developer; and measuring a film thickness of the remaining resin.
Public/Granted literature
- US11592287B2 Method for measuring distance of diffusion of curing catalyst Public/Granted day:2023-02-28
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