Invention Grant
- Patent Title: Haptic presentation apparatus, haptic presentation system, and haptic presentation method
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Application No.: US17419935Application Date: 2019-12-25
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Publication No.: US11556179B2Publication Date: 2023-01-17
- Inventor: Takeshi Ogita , Osamu Ito , Hiroshi Suzuki
- Applicant: SONY GROUP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY GROUP CORPORATION
- Current Assignee: SONY GROUP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2019-002651 20190110
- International Application: PCT/JP2019/050771 WO 20191225
- International Announcement: WO2020/145144 WO 20200716
- Main IPC: G06F3/01
- IPC: G06F3/01

Abstract:
This haptic presentation apparatus includes a first haptic presentation element that includes an air-tight and flexible first pouch into which an object has been inserted and is capable of presenting, by using an amount of gas to be exhausted from an interior of the first pouch, hardness of a virtual object in response to an operation of holding the virtual object by a user, and a second haptic presentation element that includes an air-tight and flexible second pouch and is capable of presenting, by using an amount of gas to be supplied to an interior of the second pouch, elasticity of the virtual object in response to the operation of holding the virtual object by the user.
Public/Granted literature
- US20220083140A1 HAPTIC PRESENTATION APPARATUS, HAPTIC PRESENTATION SYSTEM, AND HAPTIC PRESENTATION METHOD Public/Granted day:2022-03-17
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