Invention Grant
- Patent Title: Multilayer ceramic electronic component and method for manufacturing the same
-
Application No.: US16926923Application Date: 2020-07-13
-
Publication No.: US11557435B2Publication Date: 2023-01-17
- Inventor: Takashi Fukuma , Koji Moriyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-132137 20190717
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/012 ; H01G4/248

Abstract:
In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.
Public/Granted literature
- US20210020378A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-01-21
Information query