Invention Grant
- Patent Title: Multi-layer ceramic electronic component
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Application No.: US17237452Application Date: 2021-04-22
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Publication No.: US11557439B2Publication Date: 2023-01-17
- Inventor: Yasutomo Suga , Masataka Watabe , Takeshi Nakajima , Yuji Tomizawa , Toshiya Kuji
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: JPJP2018-134032 20180717
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/228 ; H01G4/008

Abstract:
A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axis direction and T2 represents a dimension of each extended portion in the first axis direction, T1+T2 is 50 μm or less, and T2/(T1+T2) is 0.32 or less.
Public/Granted literature
- US20210280375A1 MULTI-LAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2021-09-09
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