Invention Grant
- Patent Title: Electronic chip, the rear face of which is protected by an improved embrittlement structure
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Application No.: US16964441Application Date: 2019-01-23
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Publication No.: US11557550B2Publication Date: 2023-01-17
- Inventor: Stephan Borel , Lucas Duperrex
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1850603 20180125
- International Application: PCT/FR2019/050149 WO 20190123
- International Announcement: WO2019/145640 WO 20190801
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/768 ; H01L23/48 ; G01N21/95
Abstract:
An electronic chip includes at least an electronic circuit disposed on a front face of a substrate; and an embrittlement structure comprising at least blind holes, each extending through a rear face of the substrate and a portion of the thickness of the substrate and each having a section, in a plane parallel to the rear face of the substrate, of surface area S and having a closed outer contour, the shape of which includes at least one radius of curvature R, such that S>π·R2.
Public/Granted literature
- US20210050310A1 ELECTRONIC CHIP, THE REAR FACE OF WHICH IS PROTECTED BY AN IMPROVED EMBRITTLEMENT STRUCTURE Public/Granted day:2021-02-18
Information query
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