Invention Grant
- Patent Title: Methods of attaching die to substrate using compliant die attach system having spring-driven bond tool
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Application No.: US17412757Application Date: 2021-08-26
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Publication No.: US11557567B2Publication Date: 2023-01-17
- Inventor: Rudolphus H. Hoefs , Roy Brewel , Richard A. Van Der Burg
- Applicant: Assembléon B.V.
- Applicant Address: NL Eindhoven
- Assignee: Assembléon B.V.
- Current Assignee: Assembléon B.V.
- Current Assignee Address: NL Eindhoven
- Agent Christopher M. Spletzer, Sr.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; H01L21/683 ; H05K13/04 ; H01K13/04
Abstract:
A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.
Public/Granted literature
- US20210392802A1 COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USING THE SAME Public/Granted day:2021-12-16
Information query
IPC分类:
