Invention Grant
- Patent Title: Method and device for manufacturing array substrate, and array substrate
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Application No.: US17272939Application Date: 2019-12-06
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Publication No.: US11557611B2Publication Date: 2023-01-17
- Inventor: Qionghua Mo , En-tsung Cho
- Applicant: HKC CORPORATION LIMITED
- Applicant Address: CN Guangdong
- Assignee: HKC CORPORATION LIMITED
- Current Assignee: HKC CORPORATION LIMITED
- Current Assignee Address: CN Guangdong
- Priority: CN201811598405.4 20181225
- International Application: PCT/CN2019/123618 WO 20191206
- International Announcement: WO2020/134965 WO 20200702
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
Disclosed are a method and a device for manufacturing an array substrate, and an array substrate. The method includes: depositing and forming a gate insulation layer on a pre-formed base substrate and a pre-formed gate, the gate insulation layer covering the pre-formed gate; depositing and forming an amorphous silicon layer, a doped amorphous silicon layer including at least three doped layers, and a metal layer on the gate insulation layer in sequence, doping concentrations of the at least three doped layers of the doped amorphous silicon layer increasing from bottom to top; etching patterns of the amorphous silicon layer, the doped amorphous silicon layer and the metal layer to form the array substrate.
Public/Granted literature
- US20210327914A1 METHOD AND DEVICE FOR MANUFACTURING ARRAY SUBSTRATE, AND ARRAY SUBSTRATE Public/Granted day:2021-10-21
Information query
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