Invention Grant
- Patent Title: Image pickup element, method of manufacturing image pickup element, and electronic apparatus
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Application No.: US17145488Application Date: 2021-01-11
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Publication No.: US11557623B2Publication Date: 2023-01-17
- Inventor: Shuji Manda , Susumu Hiyama , Yasuyuki Shiga
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-202123 20130927
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/378

Abstract:
An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
Public/Granted literature
- US20210134858A1 IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS Public/Granted day:2021-05-06
Information query
IPC分类: