Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17262001Application Date: 2018-07-27
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Publication No.: US11557674B2Publication Date: 2023-01-17
- Inventor: Toshiharu Marui , Tetsuya Hayashi , Keiichiro Numakura , Wei Ni , Ryota Tanaka , Keisuke Takemoto
- Applicant: NISSAN MOTOR CO., LTD. , RENAULT S.A.S.
- Applicant Address: JP Yokohama; FR Boulogne-Billancourt
- Assignee: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- Current Assignee: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- Current Assignee Address: JP Yokohama; FR Boulogne-Billancourt
- Agency: Foley & Lardner LLP
- International Application: PCT/IB2018/001002 WO 20180727
- International Announcement: WO2020/021298 WO 20200130
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/78 ; H01L29/08 ; H01L29/16 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes: a substrate (10); a semiconductor layer (20) disposed on a main surface of this substrate (10); and a first main electrode (30) and a second main electrode (40), which are disposed on the substrate (10) separately from each other with the semiconductor layer (20) sandwiched therebetween and are individually end portions of a current path of a main current flowing in an on-state. The semiconductor layer (20) includes: a first conductivity-type drift region (21) through which a main current flows; a second conductivity-type column region (22) that is disposed inside the drift region (21) and extends in parallel to a current path; and an electric field relaxation region (23) that is disposed in at least a part between the drift region (21) and the column region (22) and is either a low-concentration region in which an impurity concentration is lower than in the same conductivity-type adjacent region or a non-doped region.
Public/Granted literature
- US20210313466A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-10-07
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