Invention Grant
- Patent Title: Integrated circuit device and method of manufacturing the same
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Application No.: US17101178Application Date: 2020-11-23
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Publication No.: US11557677B2Publication Date: 2023-01-17
- Inventor: Ji-seung Lee , Yun-seung Kang , Soung-hee Lee , Sang-gyo Chung , Hyun-chul Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0006627 20180118
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/10 ; H01L29/423 ; H01L29/66 ; H01L21/762 ; H01L21/8234

Abstract:
An integrated circuit device includes a device isolation trench defining an active area, a gate trench extending in a first direction across the active area and the device isolation film, a gate dielectric film covering an inner wall of the gate trench, and a conductive line filling a part of the gate trench above the gate dielectric film. The active area includes a fin body portion located under the conductive line, and a thinner fin portion protruding from the fin body portion toward the conductive line and having a width less than a width of the fin body portion in the first direction.
Public/Granted literature
- US20210074860A1 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-03-11
Information query
IPC分类: