Invention Grant
- Patent Title: Flexible wiring for low temperature applications
-
Application No.: US16616733Application Date: 2017-09-07
-
Publication No.: US11557709B2Publication Date: 2023-01-17
- Inventor: John Martinis
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Fish & Richardson P.C.
- International Application: PCT/US2017/050504 WO 20170907
- International Announcement: WO2019/050525 WO 20190314
- Main IPC: H01L39/24
- IPC: H01L39/24 ; G06N10/00 ; H01B11/20 ; H01B7/08 ; H01B12/16

Abstract:
The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.
Public/Granted literature
- US11527698B2 Flexible wiring for low temperature applications Public/Granted day:2022-12-13
Information query
IPC分类: