Invention Grant
- Patent Title: High-density connector
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Application No.: US17112773Application Date: 2020-12-04
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Publication No.: US11557848B2Publication Date: 2023-01-17
- Inventor: Nadav Barnea , Alek Vilensky
- Applicant: Biosense Webster (Israel) Ltd.
- Applicant Address: IL Yokneam
- Assignee: Biosense Webster (Israel) Ltd.
- Current Assignee: Biosense Webster (Israel) Ltd.
- Current Assignee Address: IL Yokneam
- Agency: Frost Brown Todd LLP
- Main IPC: H01R13/436
- IPC: H01R13/436 ; H01R13/04 ; H01R13/514

Abstract:
An electrical connector assembly includes a female connector, which includes a female connector housing defining a cavity having an hourglass shape and a first array of electrically-conductive pins disposed within the cavity. The electrical connector assembly further includes a male connector that includes a male connector housing having an hourglass-shaped protrusion dimensioned to be inserted into and fit tightly within the cavity and a second array of electrically-conductive sockets, which are contained within the protrusion and are dimensioned and aligned so that upon insertion of the protrusion into the cavity, each of the pins is introduced into and makes electrical contact with a respective one of the sockets.
Public/Granted literature
- US20220181815A1 High-Density Connector Public/Granted day:2022-06-09
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