Invention Grant
- Patent Title: Connector manufacturing method and connector
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Application No.: US17350255Application Date: 2021-06-17
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Publication No.: US11557871B2Publication Date: 2023-01-17
- Inventor: Daisuke Yamanashi
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2020-107781 20200623
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R43/00

Abstract:
A connector manufacturing method includes: a first insertion process of inserting a conductor held by a housing through an annular seal member; a second insertion process of inserting the conductor through an annular portion of a support member; a pushing-in process of pushing the seal member into a gap between an inner circumferential surface of a recess in the housing and the conductor by pressing the seal member using the annular portion; and an engagement process of making the annular portion support the seal member at a predetermined position by engaging the support member and the housing, wherein the predetermined position is a position before a bottom portion of the recess.
Public/Granted literature
- US20210399511A1 CONNECTOR MANUFACTURING METHOD AND CONNECTOR Public/Granted day:2021-12-23
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