Invention Grant
- Patent Title: Microwave processing device
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Application No.: US16611200Application Date: 2018-06-28
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Publication No.: US11558936B2Publication Date: 2023-01-17
- Inventor: Koji Yoshino , Masayuki Kubo , Osamu Hashimoto , Ryosuke Suga
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-130891 20170704
- International Application: PCT/JP2018/024538 WO 20180628
- International Announcement: WO2019/009174 WO 20190110
- Main IPC: H05B6/68
- IPC: H05B6/68 ; H05B6/66 ; H05B6/72

Abstract:
A microwave treatment apparatus includes a treatment chamber, a microwave supply, and a resonator unit. The treatment chamber is surrounded by a plurality of walls, and accommodates a heating target. The microwave supply supplies a microwave to the treatment chamber. The resonator unit is provided on one wall of the plurality of walls, and the resonator unit has a resonance frequency in a frequency band of the microwave. In this embodiment, the impedance of the surface of the resonator unit can be changed by controlling the frequency of the microwave supplied to the treatment chamber. This makes it possible to control the standing wave distribution within the treatment chamber, that is, the microwave energy distribution within the treatment chamber. As a result, in the cases where a plurality of heating targets need to be heated simultaneously, desired dielectric heating is conducted for each of the heating targets.
Public/Granted literature
- US20200163173A1 MICROWAVE PROCESSING DEVICE Public/Granted day:2020-05-21
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