Invention Grant
- Patent Title: Heat sink for electronic devices
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Application No.: US17348350Application Date: 2021-06-15
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Publication No.: US11558979B2Publication Date: 2023-01-17
- Inventor: Tao Yang , Ping Wang , Chong Yang Wang , Da Liang Ju , Zheyue Yang
- Applicant: DUPONT ELECTRONICS, INC.
- Applicant Address: US DE Wilmington
- Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee Address: US DE Wilmington
- Priority: CN202010731057.4 20200727
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values.
Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.
Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.
Public/Granted literature
- US20220030738A1 HEAT SINK FOR ELECTRONIC DEVICES Public/Granted day:2022-01-27
Information query
