Invention Grant
- Patent Title: Polyamide-based resin expanded beads
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Application No.: US17171732Application Date: 2021-02-09
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Publication No.: US11560458B2Publication Date: 2023-01-24
- Inventor: Tatsuya Hayashi
- Applicant: JSP Corporation
- Applicant Address: JP Tokyo
- Assignee: JSP Corporation
- Current Assignee: JSP Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: JPJP2020-025271 20200218
- Main IPC: C08J9/18
- IPC: C08J9/18
Abstract:
Polyamide-based resin expanded beads having a crystallite size of more than 8 nm as measured by X-ray diffraction method are provided.
Public/Granted literature
- US20210253819A1 POLYAMIDE-BASED RESIN EXPANDED BEADS Public/Granted day:2021-08-19
Information query
