Invention Grant
- Patent Title: Coil component
-
Application No.: US16774669Application Date: 2020-01-28
-
Publication No.: US11562847B2Publication Date: 2023-01-24
- Inventor: Byung Soo Kang , Yoon Mi Cha , Ju Hwan Yang , Yong Hui Li , Seo Eun Kim , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0089408 20190724
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/04 ; H01F27/29 ; H01F17/00

Abstract:
A coil component includes a body; a support substrate embedded in the body; a coil portion disposed on the support substrate, and having an end portion exposed to a surface of the body; and an external electrode disposed on the surface of the body, and in contact with and connected to the end portion of the coil portion. An interface between the end portion of the coil portion and the external electrode, and an interface between the surface of the body and the external electrode are located on levels different from each other.
Public/Granted literature
- US20210027932A1 COIL COMPONENT Public/Granted day:2021-01-28
Information query