Invention Grant
- Patent Title: Coil electronic component and method of manufacturing same
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Application No.: US16922335Application Date: 2020-07-07
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Publication No.: US11562848B2Publication Date: 2023-01-24
- Inventor: Dong Jin Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0111460 20150807
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F27/255 ; H01F27/29 ; H01F41/04 ; H01F41/02

Abstract:
A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.
Public/Granted literature
- US20200335260A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2020-10-22
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