Invention Grant
- Patent Title: Coil component
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Application No.: US16874892Application Date: 2020-05-15
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Publication No.: US11562850B2Publication Date: 2023-01-24
- Inventor: Byung Soo Kang , Seung Mo Lim , Seung Min Lee , Byeong Cheol Moon , Yong Hui Li , Ju Hwan Yang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0165359 20191212
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/24 ; H01F27/28 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
A coil component includes a body, a support substrate embedded in the body, a coil portion including first and second lead-out portions disposed on one surface of a support substrate and spaced apart from each other, slit portions formed along edge portions between both end surfaces of the body, opposing each other, and a first surface of the body, respectively, and exposing the first and second lead-out portions to internal surfaces of the slit portions, respectively, plating prevention portions embedded in the first and second lead-out portions, respectively, and having first surfaces exposed to the internal surfaces of the slit portions, respectively, and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, extending to the internal surfaces of the slit portions, respectively, and connected to the first and second lead-out portions, respectively.
Public/Granted literature
- US20210183564A1 COIL COMPONENT Public/Granted day:2021-06-17
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