Invention Grant
- Patent Title: Multi-layer ceramic electronic component, method of producing the same, and circuit board
-
Application No.: US16393209Application Date: 2019-04-24
-
Publication No.: US11562860B2Publication Date: 2023-01-24
- Inventor: Yuji Tomizawa , Wakae Akaishi
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: JPJP2018-082861 20180424
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/005 ; H05K1/18 ; H01G4/12

Abstract:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first main surface and a second main surface that face in a first direction, internal electrodes laminated in the first direction, and a penetrating hole that has a diameter decreasing from the first main surface toward the second main surface and includes a tapered surface, the internal electrodes being exposed on the tapered surface. The external electrode includes a first conductive layer disposed along the tapered surface, and a second conductive layer disposed along the first main surface and connected to the first conductive layer.
Public/Granted literature
- US20190326061A1 MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING THE SAME, AND CIRCUIT BOARD Public/Granted day:2019-10-24
Information query