- Patent Title: Dielectric member, structure, and substrate processing apparatus
-
Application No.: US17014138Application Date: 2020-09-08
-
Publication No.: US11562892B2Publication Date: 2023-01-24
- Inventor: Takashi Taira
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2019-172298 20190920
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01J37/32 ; C23C16/46 ; C23C16/458
Abstract:
A dielectric member that is attached to a lower surface of a stage is provided. The stage includes a base provided with a base channel through which a heat exchange medium passes. The dielectric member includes at least one first component including a passage that is connected to the base channel, and a second component surrounding the first component.
Public/Granted literature
- US20210090864A1 DIELECTRIC MEMBER, STRUCTURE, AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-03-25
Information query
IPC分类:
