Invention Grant
- Patent Title: Method for transferring thin layers
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Application No.: US16467254Application Date: 2017-12-08
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Publication No.: US11562899B2Publication Date: 2023-01-24
- Inventor: Pierre Montmeat , Frank Fournel
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1662146 20161208
- International Application: PCT/EP2017/081999 WO 20171208
- International Announcement: WO2018/104513 WO 20180614
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/683 ; H01L23/00 ; H01L21/20 ; H01L21/78
Abstract:
A method for transferring a thin layer onto a destination substrate having a face with an adhesive layer includes formation of a polymer material interface layer on a second face of a thin layer, opposite a first face on which an adhesive is present. The method also includes assembly by gluing the interface layer and the adhesive layer and separation of the thin layer relative to a temporary support.
Public/Granted literature
- US20190311895A1 METHOD FOR TRANSFERRING THIN LAYERS Public/Granted day:2019-10-10
Information query
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