Invention Grant
- Patent Title: Planarization apparatus, planarization process, and method of manufacturing an article
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Application No.: US16779205Application Date: 2020-01-31
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Publication No.: US11562924B2Publication Date: 2023-01-24
- Inventor: Seth J. Bamesberger , Ozkan Ozturk , Christopher Ellis Jones , Se-Hyuk Im
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/768 ; H01L21/321 ; H01L21/67
Abstract:
A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.
Public/Granted literature
- US20210242073A1 PLANARIZATION APPARATUS, PLANARIZATION PROCESS, AND METHOD OF MANUFACTURING AN ARTICLE Public/Granted day:2021-08-05
Information query
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