Invention Grant
- Patent Title: Semiconductor device with reduced vertical height
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Application No.: US16792256Application Date: 2020-02-16
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Publication No.: US11563023B2Publication Date: 2023-01-24
- Inventor: Jongseon Ahn , Youngjin Kwon , Jeehoon Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0075225 20190624
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/1157 ; H01L27/11565 ; H01L29/423

Abstract:
A semiconductor device includes a channel structure arranged on a substrate and extending in a first direction perpendicular to a top surface of the substrate, the channel structure including a channel layer and a gate insulating layer; a plurality of insulating layers arranged on the substrate and surrounding the channel structure, the plurality of insulating layers spaced apart from each other in the first direction; a plurality of first gate electrodes surrounding the channel structure; and a plurality of second gate electrodes surrounding the channel structure. Between adjacent insulating layers from among the plurality of insulating layers are arranged a first gate electrode from among the plurality of first gate electrodes spaced apart along the first direction from a second gate electrode from among the plurality of second gate electrodes.
Information query
IPC分类: