Invention Grant
- Patent Title: Semiconductor devices having air-gap spacers
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Application No.: US17074046Application Date: 2020-10-19
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Publication No.: US11563104B2Publication Date: 2023-01-24
- Inventor: Chun-Hsiung Lin , Pei-Hsun Wang , Chih-Chao Chou , Chia-Hao Chang , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/06 ; H01L21/8234 ; H01L21/764 ; H01L29/78 ; H01L21/768 ; H01L21/033 ; H01L27/088

Abstract:
A semiconductor device is provided. The semiconductor device includes a fin protruding from a semiconductor substrate and a gate structure over the fin. The semiconductor device also includes a source region and a drain region in the fin and at opposite sides of the gate structure. The semiconductor device further includes a gate spacer on a sidewall of the gate structure. The gate spacer includes an air-gap spacer and a sealing spacer above the air-gap spacer, an upper portion of the gate structure is laterally overlapping with the sealing spacer, and the bottom portion of the gate structure is laterally overlapping with the air gap spacer.
Public/Granted literature
- US20210050429A1 SEMICONDUCTOR DEVICES HAVING AIR-GAP SPACERS Public/Granted day:2021-02-18
Information query
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