Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
-
Application No.: US17227057Application Date: 2021-04-09
-
Publication No.: US11563109B2Publication Date: 2023-01-24
- Inventor: Mao-Lin Huang , Lung-Kun Chu , Chung-Wei Hsu , Jia-Ni Yu , Chun-Fu Lu , Kuo-Cheng Chiang , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L29/06 ; H01L29/78

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a fin structure formed over a substrate, and a gate structure formed over the fin structure. The gate structure includes a first layer, and a fill layer over the first layer. The gate structure includes a protection layer formed over the fill layer of the gate structure, and the protection layer is separated from the first layer by the fill layer.
Public/Granted literature
- US20220271148A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-08-25
Information query
IPC分类: