Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
-
Application No.: US17158078Application Date: 2021-01-26
-
Publication No.: US11563114B2Publication Date: 2023-01-24
- Inventor: Matthew David Smith , Hiroshi Ono , Yosuke Kajiwara , Akira Mukai , Masahiko Kuraguchi
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-208394 20201216
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/423

Abstract:
According to one embodiment, a semiconductor device includes first, second, third electrodes, a semiconductor member, and a first compound member. The third electrode is between the first and second electrodes in a first direction from the first to second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first, second, third, fourth, and fifth partial regions. A second direction from the first partial region to the first electrode crosses the first direction. The fourth partial region is between the first and third partial regions in the first direction. The fifth partial region is between the third and second partial regions in the first direction. The second semiconductor region includes first and second semiconductor portions. The first compound member includes first, second and third compound regions.
Public/Granted literature
- US20220190150A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-16
Information query
IPC分类: