Invention Grant
- Patent Title: Method of manufacturing deep ultraviolet light emitting device
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Application No.: US16811423Application Date: 2020-03-06
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Publication No.: US11563139B2Publication Date: 2023-01-24
- Inventor: Tetsuhiko Inazu , Cyril Pernot
- Applicant: Nikkiso Co., Ltd
- Applicant Address: JP Tokyo
- Assignee: Nikkiso Co., Ltd
- Current Assignee: Nikkiso Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JPJP2016-092617 20160502
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/06 ; H01L33/22 ; H01L33/32 ; H01L33/38 ; H01L33/40

Abstract:
A deep ultraviolet light emitting device includes: an electron block layer of a p-type AlGaN-based semiconductor material or a p-type AlN-based semiconductor material provided on a support substrate; an active layer of an AlGaN-based semiconductor material provided on the electron block layer; an n-type clad layer of an n-type AlGaN-based semiconductor material provided on the active layer; an n-type contact layer provided on a partial region of the n-type clad layer and made of an n-type semiconductor material containing gallium nitride (GaN); and an n-side electrode formed on the n-type contact layer. The n-type contact layer has a band gap smaller than that of the n-type clad layer.
Public/Granted literature
- US20200212252A1 METHOD OF MANUFACTURING DEEP ULTRAVIOLET LIGHT EMITTING DEVICE Public/Granted day:2020-07-02
Information query
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