- Patent Title: Methods for electromagnetic shielding using an outer cobalt layer
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Application No.: US17303135Application Date: 2021-05-20
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Publication No.: US11563267B2Publication Date: 2023-01-24
- Inventor: Anthony James LoBianco , Hoang Mong Nguyen
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/30 ; H01L23/00 ; H01L23/552 ; H01Q1/52 ; H01L23/31 ; H01Q1/38 ; H01Q1/24 ; H04B1/3883 ; H04W52/02 ; H01Q1/22

Abstract:
A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.
Public/Granted literature
- US20210336332A1 METHODS FOR ELECTROMAGNETIC SHIELDING USING AN OUTER COBALT LAYER Public/Granted day:2021-10-28
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