Invention Grant
- Patent Title: Rigid-flexible printed circuit board and electronic device including same
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Application No.: US17171461Application Date: 2021-02-09
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Publication No.: US11564311B2Publication Date: 2023-01-24
- Inventor: Youngsun Lee , Byeongkeol Kim , Yeongjin Lee , Jongmin Jeon , Jaeyoub Jung , Eunseok Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2020-0016474 20200211,KR10-2020-0160115 20201125
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/46

Abstract:
The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.
Public/Granted literature
- US20210251071A1 RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2021-08-12
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