Invention Grant
- Patent Title: Additively formed 3D object with conductive channel
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Application No.: US16098106Application Date: 2016-07-21
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Publication No.: US11565472B2Publication Date: 2023-01-31
- Inventor: Wei Huang , Lihua Zhao , Gary J. Dispoto
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Shook, Hardy & Bacon L.L.P.
- International Application: PCT/US2016/043306 WO 20160721
- International Announcement: WO2018/017096 WO 20180125
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y10/00 ; B33Y80/00 ; B29C70/88 ; B29C64/336 ; B33Y30/00 ; B33Y50/02 ; B29C64/153 ; B29C64/165 ; B29C64/10 ; B29C64/106 ; G01N27/00
Abstract:
A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.
Public/Granted literature
- US20190143605A1 ADDITIVELY FORMED 3D OBJECT WITH CONDUCTIVE CHANNEL Public/Granted day:2019-05-16
Information query
