Invention Grant
- Patent Title: Memory device
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Application No.: US17084880Application Date: 2020-10-30
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Publication No.: US11568925B2Publication Date: 2023-01-31
- Inventor: Sanjeev Kumar Jain
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: G11C11/418
- IPC: G11C11/418 ; G11C11/419 ; G11C11/412

Abstract:
A memory device is disclosed. The memory device includes a memory array including a first memory cell arranged in a first row and a first column and a second memory cell arranged in the first row and a second column next to the first column. The first memory cell is configured to perform a write operation in response to a first write signal transmitted through a first write word line. The second memory cell is configured to perform the write operation in response to a second write signal transmitted through a second write word line. The second write word line is separated from and next to the first write word line. The first write signal and the second write signal have different logic values.
Public/Granted literature
- US20220139451A1 MEMORY DEVICE Public/Granted day:2022-05-05
Information query
IPC分类: