Invention Grant
- Patent Title: Dielectric film and power capacitor comprising dielectric film
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Application No.: US16754807Application Date: 2017-10-09
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Publication No.: US11569036B2Publication Date: 2023-01-31
- Inventor: Lejun Qi , Chau-Hon Ho , Linnea Petersson , Jiansheng Chen
- Applicant: Hitachi Energy Switzerland AG
- Applicant Address: CH Baden
- Assignee: Hitachi Energy Switzerland AG
- Current Assignee: Hitachi Energy Switzerland AG
- Current Assignee Address: CH Baden
- Agency: Sage Patent Group
- International Application: PCT/CN2017/105403 WO 20171009
- International Announcement: WO2019/071396 WO 20190418
- Main IPC: H01G4/14
- IPC: H01G4/14 ; C08J7/043 ; H01G4/20
Abstract:
A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.
Public/Granted literature
- US20210193388A1 DIELECTRIC FILM AND POWER CAPACITOR COMPRISING DIELECTRIC FILM Public/Granted day:2021-06-24
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