Invention Grant
- Patent Title: Assembly provided with coolant flow channel, method of controlling assembly provided with coolant flow channel, and substrate processing apparatus
-
Application No.: US16110201Application Date: 2018-08-23
-
Publication No.: US11569073B2Publication Date: 2023-01-31
- Inventor: Jun Hirose , Kaoru Oohashi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2017-162695 20170825
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/687 ; H01L21/67
Abstract:
An assembly provided with a coolant flow channel includes a base in which the coolant flow channel is formed; and a protrusion component that is disposed in the coolant flow channel, wherein the protrusion component is liftable or rotatable.
Public/Granted literature
Information query
