Invention Grant
- Patent Title: Gold sputtering target
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Application No.: US16205471Application Date: 2018-11-30
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Publication No.: US11569074B2Publication Date: 2023-01-31
- Inventor: Tetsuya Kato , Yohei Mizuno , Chiharu Ishikura
- Applicant: TANAKA KIKINZOKU KOGYO K.K.
- Applicant Address: JP Tokyo
- Assignee: TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee: TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2016-111245 20160602
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; C23C14/14 ; C22F1/00 ; C22F1/14

Abstract:
A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 μm or more and 200 μm or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.
Public/Granted literature
- US20190103257A1 GOLD SPUTTERING TARGET Public/Granted day:2019-04-04
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