Invention Grant
- Patent Title: Substrate heating unit and substrate processing apparatus having the same
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Application No.: US16373208Application Date: 2019-04-02
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Publication No.: US11569100B2Publication Date: 2023-01-31
- Inventor: Hyun-Su Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2018-0043803 20180416
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L25/075

Abstract:
The inventive concept relates to a substrate heating unit. The substrate heating unit includes a chuck stage having an inner space defined by a base and sidewalls, a heating unit provided in the inner space of the chuck stage, and a quartz window that covers the inner space of the chuck stage and has an upper surface on which the substrate is placed. The heating unit includes a heating plate having a disk shape with an opening in the center thereof and heating modules installed in respective heating zones on the heating plate that are divided from each other, each heating module having a printed circuit board on which heating light sources emitting light for heating are mounted.
Public/Granted literature
- US20190318946A1 SUBSTRATE HEATING UNIT AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME Public/Granted day:2019-10-17
Information query
IPC分类: